| 1 |
IPC-A-610 |
Acceptability of Electronic Components |
15 |
IPC-J-STD-020 |
Moisture / Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices |
| 2 |
IPC-J-STD-001 |
Requirements for Soldered Electrical and Electronic Assemblies |
16 |
IPC-9262 |
Characterization and Qualification of AOI Equipment for Assembly Applications |
| 3 |
IPC-J-STD-033 |
Handling, Packaging, Shipping and Use of Moisture / Reflow Sensitive Surface Mount Devices |
17 |
IPC-J-STD-004 |
Flux Requirements |
| 4 |
IPC-A-600 |
Acceptability of Printed Boards |
18 |
IPC-9201 |
Surface Insulation Resistance (SIR) Handbook |
| 5 |
IPC-6012 |
Qualification and Performance Specification for Rigid Printed Boards |
19 |
IPC-9203/IPC-9202 and IPC-B-52 |
User's Guide for Standard Test Vehicles |
| 6 |
IPC-1602 |
Handling and Storage of Printed Boards |
20 |
IPC-CC-830C-CN |
Qualification and Performance of Electrical Insulation Compounds for Printed Wiring Assemblies |
| 7 |
IPC-J-STD-002 |
Solderability Testing of Component Leads, Terminals, Lugs, Posts and Wires |
21 |
IPC-TM-650 2.6.3.3 |
Surface Insulation Resistance (SIR) Testing Method for Fluxes |
| 8 |
IPC-J-STD-003 |
Solderability Testing of Printed Boards |
22 |
IPC-TM-650 2.6.3.7 |
Surface Insulation Resistance (SIR) Testing Method |
| 9 |
IPC-J-STD-005 |
Solder Paste Requirements |
23 |
IPC-TM-650 2.3.28 |
Ion Chromatography Testing Method |
| 10 |
IPC-HDBK-005 |
Solder Paste Evaluation Guide |
24 |
IPC-TM-650 |
Test Methods Manual |
| 11 |
IPC-7527 |
Solder Paste Printing Requirements |
25 |
IPC-HDBK-830 |
Conformal Coating Design, Selection and Application Guide |
| 12 |
IPC-7525 |
Stencil Design Guidelines |
26 |
IPC-9691 |
User's Guide for IPC-TM-650 Test Method 2.6.25 Conductive Anodic Filament (CAF) Resistance Testing (Electrochemical Migration Testing) |
| 13 |
IPC-7801 |
Reflow Oven Process Control Standard |
27 |
IPC-9701 |
Performance Test Methods and Qualification Requirements for Surface Mount Solder Joints |
| 14 |
IPC-7530A-CN |
Collective Soldering Process Temperature Profile Guidelines (Reflow and Wave Soldering) |
28 |
AEC-Q100 |
Stress Test Qualification for Integrated Circuits Based on Failure Mechanisms |
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